Die-Level Transient Thermal Imaging Based on Fourier Series Reconstruction for Power Industrial Electronics

Conrad Ferrer, Oriol Aviñó, Miquel Vellvehi, Xavier Jordà, Xavier Perpiñà IEEE Transactions on Instrumentation and Measurement A novel solution for off-chip electro-thermal studies in power devices at die level and short timescales is reported. The proposed method involves acquiring a sequence of thermal images on the top of the die...