On April 8, Mariana Raya, a PhD studet of the PDS Group, participated in the 26th edition of the International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), held in Utrech, The Netherlands. Mariana presented the contribution entitled “Analysis of the Magnetic Fields Only Currents (MFCO) COMSOL interface for the simulation of parasitic inductances in chip-embedding power boards”.
Chip-embedding power modules are a promising solution for multilevel converter implementation due to their high level of integration, thermal performance, and low parasitic inductance compared with standard power modules. Mariana Raya presented a study based on the COMSOL’s Magnetic Fields Only Currents (MFCO) interface to evaluate partial inductance in power chip-embedding boards, focusing on 3D modelling of a complex geometry, mesh refinement, and some issues arising from the definition of boundary conditions. Experimental inductance measurements performed on chip-embedding prototipe boards containing SiC MOSFETs were also shown to validate the simulation results.
The work was mainly developed in the framework of the HE Project SCAPE (“Switching-Cell-Array-based Power Electronics conversion for future electric vehicles”) https://www.scapepower.eu/