Other facilities


• Plasma cleaning equipment Diener “Atto”
• PCB boards / substrates reflow oven LPKF ProtoFlow
• Extreme thermal cycling system (-100ºC / +400ºC)
• Acoustic microscope Sonoscan Gen-5
• Die-shear and bond-pull system Royce-650
• SEMs with FIB (cross sections) and EDX (material analysis)
• Mechanical prototyping tools
• CNM general packaging facilities (including wedge and ball wire-bonding) in clean room (40 m2 class 1000)