From March 10 to 12, 2026, the 14th edition of the International Conference on Integrated Power Electronics Systems (CIPS) took place in Dresden, Germany. CIPS is the leading European conference for presenting the latest developments in integration power electronics system technologies, including device and converter assembly and interconnect solutions, hybrid and mechatronic system integration for high‑power‑density applications, and the operational behaviour, reliability, and availability of systems and components.

Two PDS PhD students, Emma Solà and Mariana Raya, presented significant research results related to the development of the high‑voltage switching cells (HV SC) created within the SCAPE project (https://www.scapepower.eu/).

On Monday, March 10, Mariana Raya presented her work “Simulation and Experimental Evaluation of Chip Embedding Thermal Performance” during the poster session. More than 20 attendees stopped to discuss with her the heat‑extraction capability of SiC MOSFET dies embedded in the PCB structure of the HV SC, as well as the critical aspects involved in modelling and thermally simulating these modules.

On Thursday, March 12, Emma Solà presented her work “Thick Copper Re‑Metallization Technique for Advanced Power Device Integration” in an oral session. This copper re‑metallization technique has been a key enabling technology for manufacturing SCAPE’s HV SC in a chip‑embedding format using SiC MOSFET transistors. Speaking to an audience of more than 100 people, Emma explained the main features of this unique method developed in the IMB‑CNM (CSIC) cleanroom, its limitations, and the performance results achieved in SCAPE’s HV SC.