Participation in the 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2026)

Eusebio Rodrigo during her oral presentation at EuroSimE 2026.From April 19 to 22, 2026, the 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2026) took place in Warsaw, Poland. The conference addressed results from fundamental research and industrial applications in thermal, mechanical,...