On 11–12 June 2026, the first edition of the iMAPS-Iberia Summit 2026 & Microelectronics Workshop took place in Vilanova i la Geltrú, Barcelona, Spain. The Iberia Chapter of iMAPS (International Microelectronics Packaging and Assembly Society) is a leading non-profit association in the field of advanced microelectronics packaging, interconnection, and assembly.
The event brought together companies, organizations, and professionals from across the microelectronics ecosystem to exchange innovations, present use cases and technology demonstrations, and foster networking opportunities focused on advanced packaging and microelectronics.
Speaking to an audience of more than 100 attendees, Emma Solà, a final-year predoctoral researcher from the PDS group, delivered a presentation entitled “Power chip embedding: IMB-CNM (CSIC) activities within the SCAPE project.” In her talk, she described the main features of this emerging packaging technology and presented the key achievements of the Horizon Europe SCAPE project (https://www.scapepower.eu/).
Within this project, the chip-embedding approach has proven to be an optimal solution for integrating modular and scalable switching cells using 750 V SiC MOSFETs.